RATE A
| 1. | Telecommunication electrician’s work. |
| 2. | Telecommunication mechanician’s work. |
| 3. | Calibrating of electrical instruments and/or dials and/or measuring equipment. |
RATE AA
| 1. | Electrical functional testing and/or fault localising to schematic drawings and/or specifications (n.e.s.). |
| 2. | High potential functional testing and/or fault localising when performed by persons normally engaged in operative processes (n.e.s.). |
RATE B
| 1. | Edge lapping of crystal blanks by hand, excluding calibration. |
RATE C
| 1. | All wiring and/or cable forming operations (including the preparation of) involving reference to schematic drawings (n.e.s.). |
| 2. | Cutting of raw quartz and/or crystal blanks by semi-automatic machine, including setting of angles to predetermined settings (n.e.s.). |
| 3. | Assembling of cabinets and/or frameworks where no fitting adjustments are required. |
RATE D
| 1. | Assembling (n.e.s.) where no fitting adjustments are required. |
| 2. | Mechanical and/or electrical checking of equipment involving predetermined electrical measurements and/or drawings prior to or where no functional testing is involved, excluding rectification or repairs of such equipment. |
| 3. | Complete sequential adjustment of two-motion selectors to predetermined limits. |
| 4. | Hand contouring and checking of crystal blanks to pre-set limits of frequency. |
| 5. | Repetitive visual and/or electrical testing of system discs under stereomicroscope. |
| 6. | Semi-automatic lapping and/or polishing of crystal blanks to predetermined frequency limits, including checking of frequency (n.e.s.). |
| 7. | Setting of stops on guillotine for cutting insulation only. |
| 8. | Setting of stops on tube and/or pipe bending machine. |
RATE DD
| 1. | Testing and alignment of crystal filters against predetermined limits using printout results from automatic test equipment, alignment being achieved by suitable changes of components in filter. |
| 2. | Checking and/or adjusting of crystals and/or crystal blanks to predetermined limits of frequency by evaporation and/or by etching and/or by hand. |
| 3. | Checking the cutting angle and/or correction factor of raw quartz and/or crystal blanks to predetermined limits during the process of manufacture. |
| 4. | Operating nibbling machines (n.e.s.) for batch and/or mass production on material 4 mm thickness or less. |
| 5. | Repetitive production lapping and/or checking of quartz crystal blanks to predetermined limits of time and thickness, using pre-set gauges. |
| 6. | Repetitive visual checking of system discs by comparison under standard microscope. |
| 7. | Supervision of Rate DDD to E employees. |
| 8. | Assembly and/or modification of sample printed circuit boards to instructions and/or sketches and/or photographs and/or diagrams. |
RATE DDD
| 1. | Adjustments to predetermined limits of electrically and/or mechanically operated assemblies. |
| 2. | All operations in the making of cable forms without reference to drawings (n.e.s.). |
| 3. | Assembly to sample and/or instructions and/or pictorial sketches and/or planning cards of telephone assemblies and/or selector assemblies and/or teleprinter and/or capacitors (n.e.s.). |
| 4. | Bonding of wires from transistor dice contact areas to terminal posts by means of a jig under microscopic vision (n.e.s.). |
| 5. | Friction alloying and/or wafer bonding and/or ultrasonic bonding of dice to headers by means of a jig under microscopic vision (n.e.s.). |
| 6. | Micro welding and/or nail-head bonding and/or ultrasonic bonding of gold wire to transistor leads under microscopic vision (n.e.s.). |
| 7. | Operating engraving machine, including the changing of type but excluding tool setting. |
| 8. | Repetition high potential insulation testing with foolproof testing instrument. |
| 9. | Repetitive batch checking of equipments and/or subunits and/or components to running out lists and/or samples and/or planning cards and/or pictorial sketches and/or photographs, including buzzing. |
| 10. | Repetitive batch mechanical and/or electrical checking and/or adjusting of equipments and/or subunits and/or components by comparison with fixed standards with predetermined limits by means of comparators and/or deviation meters and/or special purpose test gear (n.e.s.). |
| 11. | Soldering by hand (n.e.s.). |
| 12. | Visual checking of crystal and/or crystal blanks during the manufacturing cycle. |
| 13. | Winding on hand and/or semi-automatic machines to planning cards and/or sketches and/or diagram, including changing of self-locating mandrels and/or formers (n.e.s.). |
| 14. | Wiring to instructions and/or running out lists and/or planning cards and/or pictorial sketches and/or samples and/or audio aids and/or photographs of equipment racks and/or shelves and/or panel details and/or units, including soldering and/or wrapping of wires (n.e.s.). |
| 15. | Colouring of wires, using semi-automatic machines. |
| 16. | Preparing of bobbins and/or formers, i.e. deburring, facing, painting and varnishing. |
| 17. | Installation of radio communication equipment into vehicles under Rate A supervision. |
| 18. | Wiring of radio shelters under Rate A supervision. |
| 19. | Operating flow-solder machine, including checking of solder temperature and maintaining solder-bath levels. |
| 20. | Preforming of the ends of electronic components to instructions and/or sketches on machines, including the cutting of the ends and the adjustment of the machines by means of a calibrated dial. |
| 21. | Changing and/or replacing of components on printed circuit boards to specific instructions. |
| 22. | Operating a resin dispensing unit, including the filling of pressure chambers, and adjusting pressure according to laid-down instructions. Checking of resin and hardener mixture by weighing on a gram scale and adjusting of dispensary unit. Filling of prepared ring core coils with resin and loading into vacuum chamber. |
| 23. | Selection of marked dice under microscope. |
| 24. | Mirror loading of dice, using vacuum pencil under microscope. |
RATE E
| 1. | Assembling and/or soldering of electrical components to mountings. |
| 2. | Assembling and/or soldering and/or strapping of components to printed circuit boards, using samples and/or pre-marked boards. |
| 3. | Marking of system discs by automatic machine where manual operations are limited to loading, aligning the disc and unloading, excluding setting up of machine. |
| 4. | Production assembly and/or wiring to samples and/or planning cards and/or audio aids in jigs and/or fixtures and/or self-locating parts, including soldering and/or wrapping of wires. |
| 5. | Repetitive preparation of job description cards for cutting preformed cables to lengths. |
| 6. | Slitting system discs on semi-automatic machine, excluding setting up of machine. |
| 7. | Spotting and/or burnishing and/or wiring and/or sputtering and/or lining and/or edge cleaning and/or pasting and/or damping mass assembly and/or wire forming and/or corner dipping and/or mounting of crystal blanks by use of jigs and/or fixtures and/or machines. |
| 8. | Strapping, including sleeving and/or soldering. |
| 9. | Visual checking and/or touching up of printed circuit boards during the process of manufacture. |
| 10. | Wiring of relay bars and/or frames and/or terminal blocks to instructions and/or running out lists and/or samples and/or audio aids, including wrapping of wires. |
| 11. | Touching-up of paintwork on main and/or sub-assemblies. |
| 12. | Transferring of data to EPROMS, using automatic programmable apparatus. |
| 13. | Winding of ring core coils by hand, including tinning of wire-ends and fitting into casings and cutting wires to length. |
RATE F
| 1. | Cutting and/or trimming of components, using jigs, by power saw and/or hand press. |
| 2. | Cutting of printed circuit boards to marks. |
| 3. | Laying and binding of cable forms from prepared running out lists on prepared cable form boards not exceeding 1 m x 1,25 m. |
| 4. | Loading of components into, and unloading from, automatic test gear. |
| 5. | Mirror loading of dice, using vacuum pencil, excluding use of a microscope. |
| 6. | Operating coding machines and/or press and/or fixtures, including change of type. |
| 7. | Pen writing to samples and/or instructions and/or pictorial sketches and/or photographs. |
| 8. | Repetition production machining of bar and/or tube on capstan lathes to stops where the work piece is held by devices not necessitating any centralising or trueing, excluding setting up. (This operation is limited to a machine not exceeding a 52 mm nominal bore diameter.) |
| 9. | Repetition production winding by machine of prepared bobbins to predetermined number of turns, using round wire, including changing of bobbins (maximum length of bobbin 150 mm). |
| 10. | Selection of components and/or piece parts into work trays as per selection lists. |
| 11. | Separating and/or breaking of system discs, excluding setting of machine. |
| 12. | Washing and/or cleaning and/or packing of wafers/blanks. |
| 13. | Operating of a semi-automatic transfer printing machine, including the preparation and mixing of printing ink. |
| 14. | Operating a semi-automatic wire cutting and stripping machine, including the changing of wire lengths by operating of pre-set dials and removal and affixing of pre-set dies for differing wire diameters. |
RATE G
| 1. | Coding and/or silk screening to samples and/or instructions and/or pictorial sketches and/or photographs. |
| 2. | Dip and/or flow soldering of printed circuit boards. |
| 3. | Dipping and/or impregnation in insulating medium and/or enamel and/or paint and/or varnish and/or wax and/or resins. |
| 4. | Fly and/or treadle and/or manual pressing and/or notching and/or power pressing, where the work is operated upon with pre-set dies (excluding setting of dies). |
| 5. | Hand bending and/or forming to jigs and/or formers and/or stops. |
| 6. | Operating nibbling machine to templets and/or stops and/or marks (plate not exceeding 4 mm in thickness). |
| 7. | Operating power saw and/or band saw for repetitive cutting off to stops and/or length gauges (excluding setting of stops). |
| 8. | Repetition crimping of terminals. |
| 9. | Repetition cutting and/or slicing of raw quartz and/or crystal blanks on fully automatic machines, where the work cycle is confined to loading and/or unloading of work piece. |
| 10. | Repetition drilling to pre-marked pops and/or dimples and/or jigs and/or fixtures and/or stops, including countersinking and/or reaming by non-adjustable reamers, excluding radial drill. |
| 11. | Repetition hot and/or cold blanking and/or piercing by press, using guides and/or jigs and/or stops and/or dies. |
| 12. | Repetition machine punching to jigs and/or stops and/or gauges and/or marks. |
| 13. | Repetition marking to templets and/or jigs. |
| 14. | Repetition preparation of coil bobbins, including the application of shunt windings. |
| 15. | Repetition production assembly in jigs and/or fixtures and/or of self-locating parts from stocks where no fitting or adjustment is required, but including deburring. |
| 16. | Repetition production tinning and/or soldering of crystal cans. |
| 17. | Repetition spot and/or seam and/or projection and/or stud and/or butt and/or flash welding. |
| 18. | Repetition tinning of coil bobbin terminals. |
| 19. | Repetitive batch checking of piece parts and/or components by means of pre-set fixed gauges under supervision. |
| 20. | Riveting not exceeding 10 mm diameter rivets and/or eyeletting. |
| 21. | Routine air leak testing. |
| 22. | Spraying of enamel and/or paint and/or insulating medium and/or anticorrosive coatings, under supervision, other than blending. |
| 23. | Sticking and/or unsticking of raw quartz and/or stacking and/or bonding of crystal blanks to carriers prior to and/or after subsequent machining. |
| 24. | Stripping and/or etching of crystal blanks during the process of manufacture. |
| 25. | Washing and/or cleaning and/or coating and/or exposing and/or developing and/or etching of printed circuit boards and/or blanks. |
RATE H
| 1. | Application of insulating medium (n.e.s.). |
| 2. | Repetition cutting and pre-forming sets of wire to jigs and/or fixtures. |
| 3. | Repetition stripping of insulated wire and/or cable by pre-set tools. |
| 4. | Attending electroplating bath under instruction of a Rate A employee. |
| 8. | Dipping and/or impregnating in insulating medium and/or enamel and/or paint. |
| 9. | Dip tinning in solder pot. |
| 10. | Metal buffing and/or polishing and/or finishing. |
| 11. | Metal cleaning by pickling and/or degreasing. |
| 12. | Metal coating by dipping. |
| 13. | Rethreading and/or retapping by hand. |
| 14. | Sand and/or shot blasting. |
Manufacturing of electrical and/or electronic components for sale in bulk.
Rate A
Rate C
| 1. | Setter. Setting, maintaining and servicing of metalised capacitors and suppression manufacturing equipment. |
Rate DD
| 1. | Supervisors. Supervising section leaders. |
Rate E
| 1. | Section leaders. Monitoring of feeders and/or core winders, including supervision of preliminary preparation of production equipment by Rate H employees. |
Rate H
| 1. | Feeders. Repetition loading and/or feeding of equipment, magazines, wheels or bowls with components, including simple preliminary preparation of production equipment under supervision. |
| 2. | Core winders. Repetitive automatic and/or manual winding of wire onto cores or bobbins.” |
Surface Mount Technology Operations
Surface mount technology supervisor, supervising surface mount technology operators and surface mount technology inspectors.
Surface mount technology production assistants, engaged in the following types of activities:
| ▪ | Programming, setting, servicing and maintenance of surface mount technology machines (including printers, ovens, and pick and place machines and inspection equipment); |
| ▪ | Supervision of the machine operations done by surface mount technology operators; and |
| ▪ | File handling and back up of product data. |
Surface mount technology inspectors, engaged in the following types of activities:
| ▪ | Visual inspection and verification of “first-off” printed circuit boards using parts lists and printed circuit board layout drawing and microscope; and |
| ▪ | Repetitive visual inspection of assembled printed circuit boards according to pre-defined standards (using microscopes or automatic inspection equipment). |
Surface mount technology operators, engaged in the following types of activities:
| ▪ | Printing of solder paste onto printed circuit boards (manual and automated printing); |
| ▪ | Loading of printed circuit boards in pick and place machines; |
| ▪ | Loading and monitoring of component feeders on pick and place machines; |
| ▪ | Loading and unloading of magazines; |
| ▪ | Basic operation of various production machines; |
| ▪ | Placing components on printed circuit boards |
| ▪ | Touch-up printed circuit boards, including single-component hand soldering; |
| ▪ | Counting of printed circuit boards and components; and |
| ▪ | De-panelising of printed circuit boards |
